Rudolph Technologies expands into LED market
Posted by admin in Elctronic Stuff on February 2, 2011
FLANDERS, USA: Rudolph Technologies Inc., a leading provider of process characterization equipment and software that is designed to improve yield for the microelectronics and solar manufacturing industries, has expanded into the LED (light emitting diode) market with two significant orders.
Rudolph has shipped its Explorer Automated Macro Defect Inspection System and Discover Enterprise Data Analysis Software to a leading world-wide producer of LEDs. In addition, a US-based market leader in LEDs has placed new orders for Rudolph’s ProcessWORKS and ARTIST process control software, along with repeat orders for AutoShell factory automation software.
“Rudolph offers a suite of inspection, metrology and data analysis technologies that help high-volume LED makers better understand the causes of defects and yield loss in their front and back-end processes, ultimately lowering manufacturing costs and enhancing the performance and reliability of their products,” said Ardy Johnson, Rudolph’s marketing vice president.
Related posts
Digi-Key signs global distribution agreement with Techflex
Posted by admin in Elctronic Stuff on February 2, 2011
THIEF RIVER FALLS & SPARTA, USA: Electronic components distributor Digi-Key Corp. and Techflex, a globally recognized specialist in the engineering and manufacture of advanced sleeving solutions, announced that the two companies have entered into an agreement in which Digi-Key will distribute Techflex products to customers worldwide.
Products from Techflex are now in stock and available for purchase on Digi-Key’s global websites. Products will also be featured in future print and online catalogs.
“We are very pleased to announce this distribution agreement with Techflex with its strong product offerings in braided sleeving solutions,” said Jeff Shafer, Digi-Key’s vice president of interconnect, passive, and electromechanical products. “Adding Techflex’s quality product line to Digi-Key’s offering exemplifies our commitment to provide our customers with the broadest range of products for the electronics industry.” Read the rest of this entry »
Related posts
Molex zQSFP+ interconnect system provides high-performance products meeting high-density apps
Posted by admin in Elctronic Stuff on February 1, 2011
DesignCon 2011, LISLE, USA: Molex Inc. has introduced the z-Quad Small Form-factor Pluggable Plus (zQSFP+) interconnect solution, designed for high-density applications found in telecommunications, data networking, test and measurement and medical diagnostic equipment.
The zQSFP+ system, which provides proven 25 Gbps data rates, will be demonstrated in Molex booth 501 at DesignCon 2011, February 1 and 2, Santa Clara, CA. The products support next-generation 100 Gbps Ethernet and 100 Gbps InfiniBand* Enhanced Data Rate (EDR) applications and are designed to accommodate stacked and ganged connector configurations in extremely high-density requirements.
“The new zQSFP+ connector system allows users to deliver high-performance connectivity while maximizing real estate usage compared to traditional SFP+ products,” said Joe Dambach, new product development manager, Molex. “It’s also a highly-integrated system that provides excellent thermal performance, signal integrity (SI), electromagnetic interference (EMI) protection and some of the lowest power consumption in the industry for optical cable assemblies.”