Diodes Inc.’s op-amps raise audio performance
Posted by admin in Elctronic Stuff on February 3, 2011
DALLAS, USA: Diodes Inc., a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, announced the release of the APX4558 dual channel op-amps.
With a low input noise performance of only 8nV/√Hz at 1kHz, these dual channel op-amps meet demands for higher performance audio without an increase in BOM cost. This performance, coupled with a wide unity gain bandwidth of 3MHz, makes the op-amps well suited to a broad range of cost-sensitive audio products including set top boxes and pre-amplifiers.
Two variants are being offered by Diodes, the commercial grade APX4558 with an operating temperature range of 0ºC to 70ºC and the industrial grade APX4558I, operating from -40ºC up to 105ºC. Both new parts are provided in the SO8 package and are pin-for-pin compatible with industry standard op-amp alternatives.
Related posts
RFMD receives first production orders for PowerSmart power platform
Posted by admin in Elctronic Stuff on February 3, 2011
GREENSBORO, USA: RF Micro Devices Inc. has received its first volume production orders for its PowerSmart power platforms. The production orders are in support of a highly anticipated smartphone and tablet product family to be launched by a leading cellular handset manufacturer beginning in the March, 2011, quarter.
Eric Creviston, president of RFMD’s cellular products group (CPG), said: “RFMD’s PowerSmart power platforms are a new product category reshaping the future of multimode, multi-band cellular RF architectures. PowerSmart power platforms feature a revolutionary new RF Configurable Power Core™ that delivers multiband, multi-mode coverage of all cellular communications modulation schemes, including 2G, 3G and 4G, up to LTE 64QAM.”
In addition to the RF Configurable Power Core, which performs all power amplification and power management functionality, RFMD’s PowerSmart power platforms also include all necessary switching and signal conditioning functionality in a compact reference design, providing smartphone manufacturers a single scalable source for the entire cellular front end.
Related posts
Molex intros iPass+ high-speed channel (HSC) CXP copper and optical products at DesignCon
Posted by admin in Elctronic Stuff on February 2, 2011
DesignCon 2011, LISLE, USA: Molex Inc. has announced its newest additions to the iPass+ product family.
The iPass+ High-Speed Channel (HSC) CXP copper and optical system offers connectors and cables that achieve rates of up to 120 Gbps of pluggable data over 12 lanes in one assembly. The first-to-market technology will be on display in Molex booth 501 at DesignCon 2011, February 1 and 2, Santa Clara, CA. This dual paddle-card system was adopted as the InfiniBand* CXP 12x QDR standard and by IEEE 802.3ba as the 100G Ethernet standard, providing 10 lanes of 10 Gbps data rates.
Molex has leveraged the latest high data-rate capable wafer technology and compliant-pin tails to develop two integrated connector offerings for the growing server-storage market:
The enhanced footprint version is a high-density, 10-channel connector, which conforms to IEEE 802.3ba requirements for the 10-channel 100 Gigabit Ethernet interface and provides a path to future terabit networks.